Wafer Level Various Plating Contract Processing Services
We accept wafers of all sizes! Leave the plating processing service to us!
At Assist Navi, we offer "Wafer Level Various Plating Contract Processing Services." Please leave the processing of "Rewiring Formation and BUMP Processing," "TSV (through-silicon via) Processing," and "Electroless Plating (UBM Plating)" to us. 【Rewiring Formation and BUMP Processing】 <Main Processing Services> ■ Cu Plating Rewiring Processing (Line & Space 10μm/10μm) ■ BUMP Processing: Cu, Ni, Au, Solder (Sn-Ag, Sn-Ag-Cu) Low Melting Point Solder, etc. ■ N Electroforming *For more details, please refer to the PDF document or feel free to contact us.
- Company：アシストナビ
- Price：Other
